 |
| English | Chinese Taiwan |
| flip ahead | 快速翻頁 (To go to the next page on a site quickly by swiping across the page or clicking the Forward button) |
| flip chip packaging | 覆晶封裝 (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) |