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Terms for subject Microsoft containing chip | all forms
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empaquetado flip-chipflip chip packaging (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins)
sistema en un chipsystem on a chip (A chip that integrates most of all of the basic components of a computer, including microprocessors and necessary support components. SOC technology is used in firewalls, gateways, specialized servers, and interactive devices)