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empaquetado flip-chip | flip chip packaging (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) |
sistema en un chip | system on a chip (A chip that integrates most of all of the basic components of a computer, including microprocessors and necessary support components. SOC technology is used in firewalls, gateways, specialized servers, and interactive devices) |