Terms for subject Electronics containing 后面

Chinese	English
交战后地面影响模型	post engagement ground effects model
先触点后平面化蚀刻工艺	planarization after contact etch process
后加热铝平面化工艺	aluminum-planarization by postheating process
后向散射截面	monostatic cross section
后向散射截面	back scattering cross-section
后面板标识	rear label
连接器后面	connector rear