| English | French |
| chip-on-board | montage direct des puces (A manufacturing technology that mounts an integrated circuit die directly to a circuit board. The die is electrically connected to the circuit board using wire bonding, and is then covered with a protective epoxy cover) |
| chip set | circuit microprogrammé (A collection of chips designed to function as a unit in the performance of some common task. The term is most commonly used to refer to the set of integrated circuits, such as the programmable interrupt controller, that support a CPU together with the CPU itself. Often a chip set will fit on one chip) |
| flip chip packaging | technique de conditionnement de la puce retournée (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) |
| on-chip performance counter | compteur de performance de processeur (A register on a CPU chip that stores very low-level information. This information can be queried) |
| system on a chip | système sur puce (A chip that integrates most of all of the basic components of a computer, including microprocessors and necessary support components. SOC technology is used in firewalls, gateways, specialized servers, and interactive devices) |
