Terms for subject Electronics containing via

English	Chinese
any layer inner via hole structure	完全内部通孔结构各层之间都采用内通孔的PWB 结构
computer analysis of networks via inversion of network equations	网络方程反演式计算机网络分析
constrained via minimization	约束通孔最小化问题
direct charging via the discharge pin	直接经放电管脚充电
direct charging via the substrate pin	直接经衬底管脚充电
estimation of signal parameters via rotational invariance techniques	基于旋转不变性原理的信号参数估算技术
information via telex	由用户电报传递的信息
interdigitated via chain structure	叉指式通路结构
interstitial via hole	填隙通路孔
interstitial via hole	间隙通孔
light emission via inelastic tunneling	非弹性隧穿光发射
structural analysis via the finite element method with graphics	有限元图解法结构分析法
tracking via missile	由导弹跟踪
tracking via missile	通过导弹跟踪
via hole	过孔
via net loss factor	通路净损耗因子
via radio teletypewriter	采用无线电传
via radio teletypewriter	通过无线电电传打字机